1. 2. 3. material content data sheet sales product name xmc1201-t038f0064 ab issued 7. october 2015 ma# ma001433394 package pg-tssop-38-9 weight* 118.39 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.226 1.04 1.04 10353 10353 leadframe inorganic material phosphorus 7723-14-0 0.015 0.01 127 non noble metal zinc 7440-66-6 0.060 0.05 506 non noble metal iron 7439-89-6 1.199 1.01 10126 non noble metal copper 7440-50-8 48.679 41.12 42.19 411170 421929 wire noble metal palladium 7440-05-3 0.003 0.00 27 non noble metal copper 7440-50-8 0.311 0.26 0.26 2629 2656 encapsulation organic material carbon black 1333-86-4 0.192 0.16 1620 plastics epoxy resin - 7.479 6.32 63167 inorganic material silicondioxide 60676-86-0 56.249 47.52 54.00 475102 539889 leadfinish non noble metal tin 7440-31-5 2.200 1.86 1.86 18580 18580 plating noble metal silver 7440-22-4 0.337 0.28 0.28 2849 2849 glue plastics epoxy resin - 0.111 0.09 936 noble metal silver 7440-22-4 0.332 0.28 0.37 2808 3744 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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